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Soldering Heat Sink

Precise assembly for specific applications

Soldering Heat Sink

Overview

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Precise assembly process

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Excellent thermal interface

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Multiple solder options

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Reworkable connections

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Cost-effective joining

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Automated assembly capable

Technical Specifications

Soldering Parameters

  • •Solder Types: Lead-free/SAC305
  • •Process Temp: 217-250°C
  • •Joint Thickness: 50-200μm
  • •Void Content: <5%
  • •Wetting Angle: <30°

Assembly Specifications

  • •Component Size: 5-200mm
  • •Placement Accuracy: ±0.1mm
  • •Temperature Control: ±2°C
  • •Flux Types: No-clean/Water-soluble
  • •Production Rate: Up to 300/hour

Performance Metrics

  • •Thermal Resistance: 0.2-1.5°C/W
  • •Shear Strength: >1000 PSI
  • •Temperature Range: -40°C to +125°C
  • •Thermal Cycles: >1000
  • •Expected Life: 5-10 years

Common Applications

Electronics Assembly

  • •PCB Assembly
  • •Component Cooling
  • •LED Modules
  • •Power Supplies
  • •RF Components

Consumer Products

  • •Computer Hardware
  • •Gaming Consoles
  • •Audio Equipment
  • •Network Devices
  • •Display Systems

Industrial Electronics

  • •Control Systems
  • •Sensor Assemblies
  • •Power Modules
  • •Drive Components
  • •Automation Equipment

Design & Engineering Services

Process Development

  • •Solder Selection
  • •Profile Development
  • •Fixture Design
  • •Process Control
  • •Quality Parameters

Manufacturing Support

  • •Production Setup
  • •Process Optimization
  • •Quality Control
  • •Operator Training
  • •Documentation

Quality Assurance

  • •Visual Inspection
  • •X-Ray Inspection
  • •Pull Testing
  • •Thermal Testing
  • •Reliability Testing

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Extruded Heat Sink

Extruded Heat Sink

Cost-effective solutions for high-volume applications

Ready to Optimize Your Thermal Management?

Contact our engineering team to discuss your heat sink requirements and get expert consultation.

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Contact Us

  • Email: [email protected]
  • Address: 11 Longjiangyi Rd, Dong Guan Shi, Guangdong Province, China, 523690

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